Diamond wire saw is mainly used for wire cutting of brittle materials, such as mono/poly crystalline silicon, sapphire, carbonated sand, alumina, quartz, glass, precision ceramics, graphite, etc.
Characteristics:
√ Excellent cutting benefit
√ Excellent wafer surface
√ Excellent service life
√ Low cost
Specification
√ Φ60μm
√ Φ57μm
√ Φ55μm
√ Φ52μm
√ Φ50μm
√ Φ47μm
√ Φ45μm
Diamond grit size: 4-12μm;
Diamond density: 90-170pcs/mm
Copyright © 2020-2024 Jiangsu R.R. Solar Energy Co., Ltd.